Dubai Silicon Oasis eyes microelectronics giants in France at the Interconex 2008

Dubai Silicon Oasis will utilise the platform of the forum to showcase a continuum of corporate services and highlight its state-of-the-art infrastructure that is tailored to host international technology corporations.

Commenting on this participation, a DSOA official stated that the silicon oasis is committed towards attracting International technology companies and its management is confident that the presence of a wide spectrum of microelectronic Design & manufacturing companies at Interconex 2008 will be an ideal opportunity to reveal the DSO's comparative advantages for companies operating out of Dubai in general, and Dubai Silicon Oasis in particular.

Participating in Interconex 2008 is another step for DSOA to showcase its value proposition to global technology industries; thus communicating the growing opportunities in this mounting region that is eager for more technology innovations.

The forum will address topics on Materials and new processes including lead-free, polymers, assembly process, intraconnections, Printed Circuit Boards (PCB), new technologies, and Large BGA packages. Furthermore, advanced packaging and interconnection technologies will be highlighted during the event. Such technologies include SiP, 3D packaging, wafer level, Packaging, Electronics on flexible support, Applications including Microsystems, power, medical, telecommunication, automotive industries, Modelling, simulation, Thermal management, Test, reliability and characterization.

DSOA is a wholly-owned entity of the government of Dubai, operating as a free zone technology park for semiconductors, microelectronics and other electronic-based companies looking to set up their regional headquarters and R&D divisions.